Service Offering for Semiconductor Failure Analysis by TechCorr USA

As semiconductor devices’ structures shrink and complexity increases, detecting defects and localizing failures becomes more crucial, yet challenging. This necessitates advanced techniques and tools for precise failure analysis to enhance yield and expedite data extraction. TechCorr USA specializes in comprehensive semiconductor failure analysis and defect localization services, utilizing cutting-edge technologies to address these challenges and provide actionable insights.

Defect Localization and Analysis

With a focus on achieving higher yield and faster time-to-data, TechCorr USA offers the following specialized services:

• Optical Fault Isolation: Analyzing the performance of electrically active devices to pinpoint critical defects causing failures in semiconductor manufacturing.
• Thermal Fault Isolation: Utilizing high-sensitivity lock-in infrared thermography to detect localized temperature increases causing device failures.
• Transmission Electron Microscopy (TEM) Imaging and Analysis: High-resolution imaging and analysis of semiconductor devices for diagnosing failure mechanisms and optimizing process yields.
• Scanning Electron Microscopes (SEM) for Semiconductor Analysis: Covering various imaging tasks and advanced failure analysis techniques requiring precise voltage-contrast measurements.
• Nanoprobing: Precisely localizing electrical faults critical for an effective transmission electron microscopy failure analysis workflow in complex devices.
• Laser Ablation: Providing high-throughput milling of semiconductor devices for imaging and analysis with electron microscopy while preserving sample integrity.
• Atom Probe Tomography (APT) Sample Preparation: Offering atomic-resolution 3D compositional analysis of materials using focused ion beam microscopy. Device
• Delayering: Critical for detecting buried electrical faults in increasingly complex semiconductor designs without damaging the devices.
• ESD Compliance Testing: Verifying devices meet electrostatic discharge compliance standards to prevent damage to small features and structures in semiconductors.

Inspection Services

TechCorr USA also offers a range of inspection options to extend system functionality, including:

• Bright Light Inspection variations such as +Gyro, +EdgeGyro, and +Gimbal, catering to different wafer inspection needs and specifications.
• Automated Optical Inspection (AOI) with MIDS module, designed to help detect common visible macro defects without the need for golden images, ensuring integrated operation and reporting.
• P/N Type Detector for determining P-Type or N-Type wafer doping for silicon manufacturers in parallel with wafer alignment.
• Wafer Edge Inspection for scanning wafer bevels for cracks and chips, capturing defects down to minute sizes and aiding in wafer quality assessment.
• Wafer Flip and Wafer Slip Detection options to cater to specific applications and detect slip-related issues using specialized lighting and software.
• Wafer Surface Inspection and Wafer Thickness Measurement services using cutting-edge optics and laser technology for defect detection and precise measurements, aiding in quality control.

TechCorr USA’s comprehensive suite of services and specialized inspection options aims to assist semiconductor manufacturers in enhancing yield, improving reliability, and expediting time-to-data through accurate failure analysis and defect localization.